JPS648734U - - Google Patents

Info

Publication number
JPS648734U
JPS648734U JP10255987U JP10255987U JPS648734U JP S648734 U JPS648734 U JP S648734U JP 10255987 U JP10255987 U JP 10255987U JP 10255987 U JP10255987 U JP 10255987U JP S648734 U JPS648734 U JP S648734U
Authority
JP
Japan
Prior art keywords
wired
wiring structure
electrical wiring
conductive particles
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10255987U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0526747Y2 (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987102559U priority Critical patent/JPH0526747Y2/ja
Publication of JPS648734U publication Critical patent/JPS648734U/ja
Application granted granted Critical
Publication of JPH0526747Y2 publication Critical patent/JPH0526747Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Landscapes

  • Multi-Conductor Connections (AREA)
  • Wire Bonding (AREA)
JP1987102559U 1987-07-03 1987-07-03 Expired - Lifetime JPH0526747Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987102559U JPH0526747Y2 (en]) 1987-07-03 1987-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987102559U JPH0526747Y2 (en]) 1987-07-03 1987-07-03

Publications (2)

Publication Number Publication Date
JPS648734U true JPS648734U (en]) 1989-01-18
JPH0526747Y2 JPH0526747Y2 (en]) 1993-07-07

Family

ID=31332576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987102559U Expired - Lifetime JPH0526747Y2 (en]) 1987-07-03 1987-07-03

Country Status (1)

Country Link
JP (1) JPH0526747Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031030A (ja) * 2001-07-12 2003-01-31 Sekisui Chem Co Ltd 微粒子配置導電接続フィルム、微粒子配置導電接続フィルムの製造方法及び導電接続構造体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279139A (ja) * 1985-06-04 1986-12-09 Nec Corp 混成集積回路装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279139A (ja) * 1985-06-04 1986-12-09 Nec Corp 混成集積回路装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031030A (ja) * 2001-07-12 2003-01-31 Sekisui Chem Co Ltd 微粒子配置導電接続フィルム、微粒子配置導電接続フィルムの製造方法及び導電接続構造体

Also Published As

Publication number Publication date
JPH0526747Y2 (en]) 1993-07-07

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